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Ta-SiC Thin Film Resistors for Highly Reliable Thermal Printing Heads

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3 Author(s)
K. Nunomura ; NEC Corporation, Kawasaki, Japan ; N. Koyama ; T. Matsubara

A Ta-SiC thin film resistor has been newly developed for highly reliable thermal printing heads. The Ta-SiC film, which is formed by a sputtering technique, has a stable amorphous structure containing microcrystalline Tac. The film crystallization hardly develops, even at temperatures up to 800°C. In addition to this structural stability, it has chemical stability and oxidation resistance. A thermal printing element test piece has been fabricated composed of a 17 at% Ta-SiC heating resistor, Al conductor, and a sputtered SiC surface protective layer on a g!azed alumina substrate. High temperature resistor annealing and alkaline metal- and lead-free glaze substrate adoption are effective for stability improvement. As a result, highly reliable high speed thermal printing elements were realized, Which could generate more than 5 x 108heatpulses at above 500°C peak temperature with 0.5-2.0 ms short electric current pulses.

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:6 ,  Issue: 4 )