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Physical Analysis of Data on Fused-Open Bond Wires

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1 Author(s)
E. Loh ; Hughes Aircraft Company, El Segundo, CA, USA

Peddy's experimental data on fusing current, fusing time, and fused length of gold and aluminum bond wires used in transistors and integrated circuits are analyzed in terms of physical properties and size of the wire by simplified heat equations. Results of this physical analysis provide a useful guide to compare and extrapolate existing data and suggest steps in estimating fusing current and duration from an observed fused length on bond wires with known diameter, length, and material.

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:6 ,  Issue: 2 )