By Topic

The Application of Thermoelectric Spot Cooling to Electronic Equipment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Stubstad, W. ; Collins Radio Co.

Summary Recent developments in the construction of thermoelectric coolers have resulted in improved coolers suitable for use in electronic equipment. The continual effort to improve the techniques of cooling electronic equipment led to the investigation of thermoelectric spot cooling of temperature-limiting component parts located within local areas of an electronic equipment. The investigation consisted of the evaluation and application of nine spot coolers constructed to specifications determined by an analysis. Thermal evaluation of the nine spot coolers showed that each spot cooler either met or exceeded the design requirement of pumping 5 w over a 30°C temperature difference. The coefficient of performance exceeded 0.5 for each of the spot coolers operated under the design condition. In addition to the satisfactory thermal performance, a spot cooler passed the mechanical shock and vibration requirements for satellite equipments used in Project Mercury. The information on spot cooler thermal performance was employed in an analytical application of spot cooling to a free-convection and radiation-cooled equipment and a forced-convection-cooled equipment. The results indicate that free-convection - and radiationcooled equipment can be operated in higher temperature environments with spot cooling; moreover, the cooling requirements for forced-convection-cooled equipment can be reduced.

Published in:

Product Engineering and Production, IRE Transactions on  (Volume:5 ,  Issue: 4 )