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High Density Electronic Packaging via Welded Honeycomb Structures

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1 Author(s)
Johnson, C.W. ; Electronic Tube Division, Sperry Gyroscope Co., Division of Sperry Rand Cor.

A system of packaging based on the Sperry "Honeycomb" concept is described which attempts to resolve the major problems associated with other current packaging schemes. The paper reviewsthe considerations of high density welded three-dimensional packaging and some advantages and disadvantages of the popular concepts. This method is particularly applicable to develop programs since it permits evaluationo the circuit prior to final encapsulation. The paper details a typical circuit package from its original circuit schematic through packaging layout, assembly, testing and final encapsulation. It also shows how the packaging method can be adapted to permit replacement of components if required.

Published in:

Product Engineering and Production, IRE Transactions on  (Volume:5 ,  Issue: 2 )

Date of Publication:

Jun 1961

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