By Topic

Prediction of Component Temperatures on Circuit Cards Cooled by Natural Convection

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Campo, W. ; IBM Corp, Endicott, NY, USA ; Kerjilian, G. ; Shaukatullah, H.

An empirical procedure to predict component temperatures on circuit cards cooled by natural convection is described. With this procedure, test results from cards populated with only one type of component can be used to predict temperatures on cards with a mix of components.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:5 ,  Issue: 4 )