By Topic

Application of the Finite Element Method to Determine the Electrical Resistance, Inductance, Capacitance parameters for the Circuit Package Enviornment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
L. Olson ; IBM Corp, Endicott, NY, USA

A finite-element program, Fierce, is used to obtain representative R, L, C electrical parameters for various two-dimensional conductor/dielectric packaging structures. The calculated results of Fierce are compared with an existing program C2D and correlated to hardware measurements. Specific advantages of Fierce are cited for ,modeling complex multilevel wiring packages with mixed dielectrics and several grounds. The concluding example demonstrates the capability of Fierce to characterize nine conductor--five dielectric model(s). The R, L, C outputs are inputed to a circuit analysis program, Astap, to compare the performance advantage of a ground plane located close to the conductors versus a far ground plane for a high performance application (800 ps driver switching speeds).

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:5 ,  Issue: 4 )