Cart (Loading....) | Create Account
Close category search window
 

Humidity Test of Premolded Chip Carriers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Martin, Jacob H. ; Charles Stark Draper Lab, MA ; Hanley, L.

Premolded chip carrier packages made by AMPl containing test chips coated with various protective materials were humidity-tested at 85°C/85 percent relative humidity (RH) with a 40-V dc bias for 1000 h. The test chips were also packaged in plastic dual in-line packages (DIP's), and ceramic DIP's and tested at the same time for comparison. The purpose of this test was to gather preliminary information on the suitability of the premolded chip carrier as a semiconductor package. As expected none of those in the hermetic packages failed. The test chips in the chip carrier with protective coatings survived better than those in the plastic DIP's, and one of the chip carrier groups had no failures. The data are sufficiently encouraging to recommend continued development and testing of premolded packages.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:4 ,  Issue: 2 )

Date of Publication:

Jun 1981

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.