By Topic

"Fountain" Soldering -- Its Background and Development

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
T. Stearns ; Sanders Associates, Nashua

Old, tried, and true principles are described as they have been applied to a modified "fountain" soldering technique, to virtually eliminate "drossing" (tin and lead oxidation) and to reduce contamination to a minimum. A history is given of the development of this technique at Sanders, dating from the early days of the "Tinkertoy" program. An early sheet-aluminum stencil and "solder boat" dipping method is discussed, with relation to the long time-cycle and the trapped-gasses problem. Mentioned, is an improvement of bringing the solder to the work in solder cups, but which was mechanically grotesque and faced with the twin problem of thermal-loss and dross-formation. A one-shot pump modification is credited with being the forerunner of the true "fountain". Presented as the final solution, is a positive-displacement pump that supplies solder through a baffled manifold to selected tube sizestgiving a steady flow of solder which "fountains, to a uniform height above the tubes. Advantages of the "fountain" technique are listed, with emphasis being placed on accurate temperature control and lower soldering temperatures. A refinement is introduced in the form of an anti-oxident oil layer to control drossing, as used in the tinware industry in the "flow-brightening" of electrodeposited tin. Other precautions are outlined which reduce contamination. Growing out of this soldering technique for printed wiring, a resistor-wafer soldering machine is described (for stacked-wafer modules using standard resistors). Also presented, is a "piledriver" soldering machine for wafers using printed silver patterns and printed component parts.

Published in:

IRE Transactions on Production Techniques  (Volume:3 ,  Issue: 1 )