We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Thick-film Technology: An Introduction to the Materials

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Larry, J. ; E.I. du Pont de Nemours & Co., Inc., NY ; Rosenberg, R. ; Uhler, R.

The use of thick-film technology to manufacture electronic circuits and discrete passive components continues to grow at a rapid rate worldwide. When applied to hybrid microcircuits, it can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. The strength of the thick-film approach is a consequence of function, size, and unit cost trade-offs; advances in materials have played a major role relative to each of these factors. Thick-film materials are developed to meet needs defined by electronic circuit design and process engineers. A general understanding of thick films is provided from a materials standpoint, particularly for the new engineer. Background is developed for a basic, yet simple, understanding of the components that make up resistor, conductor, and dielectric compositions, of processing, and of the properties of the final thick-film composite structures.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:3 ,  Issue: 2 )