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Low Expansivity Organic Substrate for Flip-Chip Bonding

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1 Author(s)
S. Greer ; IBM General Business Group, NY

Organic substrate materials with thermal expansion coefficients (TEC) approaching that of silicon have been fabricated with laminate composites using DuPont's Kevlar® fiber. When combined with controlled-collapse solder chip joining technology, chip-to-substrate interconnections are essentially free of fatigue failure caused by thermal cycling. This failure mode limits the ultimate silicon chip size on products joined by flip-chip bonding to alumina substrates. By using conventional printed circuit board fabrication techniques, extensions of these organic structures to multilevel applications have been shown feasible.

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:2 ,  Issue: 1 )