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Thermal Conductivity Enhancement of Epoxies by the use of Fillers

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1 Author(s)
Nieberlein, V. ; U.S. Army Missile Res. and Dev. Command,Redstone Arsenal, AL

To predict the effect of fillers on the thermal conductivity of epoxies, a model has been proposed which consists of a right circular cylinder of epoxy with a hemisphere of a thermally conductive material imbedded in each end. The laws of heat conduction are then applied to this model to obtain a composite thermal conductivity. The effect of packing density of the spheres is considered, then modified, to accommodate the highly nonspherical nature of the filler particle aggregates. A projection is made to show the effect of filler thermal conductivity and filler concentration on the expected thermal conductivity of an epoxy-base composite. A graphical comparison of these two effects is presented.

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 2 )