Cart (Loading....) | Create Account
Close category search window

Fuse Resistor Consisting of a Metallic Thin Film and a Polymerized Organic Film on a Substrate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Horiguchi, K. ; Susumu Industrial Company,Ltd.,Kyoto, Japan ; Ozawa, P.

A new type of fuse resistor has been made by the following method. A polymerized organic film is formed on a substtate by the plasma polymerization method. Then a Ni-Cr thin film is deposited by vacuum evaporation to form a crossover pattern. Resistors have been fabricated in the range 0.47-10 000Omega, ¼ W, which exhibit uniform characteristics with respect to opening time. Fusing action occurs at relatively low temperatures by thermally induced changes in the organic film. This paper describes the opening characteristics as well as the normal resistor properties.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:13 ,  Issue: 4 )

Date of Publication:

Dec 1977

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.