By Topic

Tab Lead Capacitor

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Love, G. ; Components Department,Greenville,SC ; McLaurin, E. ; Hucks, W.

Differential thermal expansion between a monolithic chip capacitor and the common hybrid substrate materials gives rise to significant stresses in the chip. For conventional attach techniques and conventional chips, these stresses may exceed the strength of one or more of the components, chip, termination, substrate metallization, or solder, in the assembly with disastrous effects. Further, common choices of materials aggravate the basic problem by "building-in" opportunities for delayed failure due to slow formation of brittle intermetallies in the assembly. We have examined this problem in detail, and we offer a solution that incorporates material, process, and design innovations which essentially eliminate these problems as sources of device failure.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:13 ,  Issue: 3 )