Cart (Loading....) | Create Account
Close category search window
 

Computerized Thermal Analysis of Hybrid Circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
David, R. ; Teledyne Microelectronics,Los Angeles

A computer program was written to perform steady-state analysis for hybrid circuits. The output of the program gives the temperature of each power dissipating element in the hybrid. The program is based upon solution of Laplace's equation in three dimensions using Fourier techniques. The assumptions made are: no convection or radiation, constant and isotropic thermal conductivity for any single material, and constant temperature at the bottom of the hybrid package. Bessel's inequality allows one to input the desired accuracy and to determine where the infinite series should be truncated. Theoretically, the program will attain any desired accuracy less than 100 percent, but practical considerations of computer run times limit accuracies to the 90- to 95-percent region. The program has been tested by comparing computer results to known theoretical exact solutions and to actual measurements on sample hybrids. When compared to known theoretical exact solutions, the computer result accuracy is between 95 and 100 percent. When compared to actual measurements on sample hybrids, the computer result accuracy is between 90 and 95 percent. This program has been used successfully on over twenty circuit designs. It has also been used to evaluate simpler types of thermal anal- yses.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:13 ,  Issue: 3 )

Date of Publication:

Sep 1977

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.