By Topic

Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power Transistors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Sung Kang ; Nova Scotia Technical College,Halifax ; Zommer, N. ; Feucht, Donald L. ; Heckel, R.W.

Scanning electron microscopy was employed to characterize the structure of the soft-soldered joints in Si power transistors (type 2N3055), which failed electrically during thermal cycling. Cracks were observed in the soldered joint of many failed devices. Crack propagation seems to be accelerated by the presence of voids in the joint region. The importance of the reactions between the Ni layers and Sn of the .solder also affects the long-term reliability of the devices. Fractographs obtained from the failed devices reveal ductile fracture of the soft solder as well as creep or fatigue failure of the solder at the elevated temperature. Based on the structural studies of both failed and uncycled devices, some possibilities for improving device performance are discussed.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:13 ,  Issue: 3 )