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Assessment of Silicone Encapsulants for Hybrid Integrated Circuits (HIC)

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1 Author(s)
Christou, A. ; Naval Research Laboratory,Washington

A silicone encapsulant has been investigated as to its effectiveness in preventing migrated gold resistive shorts (MGRS). Using a temperature cycle of -10°C to +100°C, MGRS formation was observed at moisture levels of 0.9 to 1.2 percent V/V for Cl-, 1-, K+, and Na+ion contaminated environments. The results indicate that water molecules and halogen, Na+and K+ions will be readily transmitted through the silicone material. Dendritic growth has been found to occur when threshold water and ion levels were exceeded. A technique for measuring the kinetics Of moisture penetration through encapsulants is described. The method consists of utilizing moisture mi-. crosensors bonded within the candidate hybrid package; followed by microspot AES, EDXA analysis of ionic contamination. The test results from the hybrid moisture microsensors are compared with kinetics data' obtained by measuring surface currents on .thermal SiO2. Measured moisture and ionic contamination levels and the formation of MGRS in the presence of Na, I, K, Cl, S ions are summarized.

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Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:13 ,  Issue: 3 )