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The interconnection algorithm originally presented by Lee is outlined and some of its features are discussed. The implications of the various technologies to which it may be applied are presented, and it is shown that for multilayer hybrid microcircuits the algorithm can be extended to advantage. Typical results using the extended algorithm are given.
Parts, Hybrids, and Packaging, IEEE Transactions on (Volume:13 , Issue: 2 )
Date of Publication: Jun 1977