By Topic

Wiring Algorithms for the Computer-Aided Layout of Multilayer Hybrid Microcircuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Price, I. ; Plessey Co. ; Moran, P.

The interconnection algorithm originally presented by Lee is outlined and some of its features are discussed. The implications of the various technologies to which it may be applied are presented, and it is shown that for multilayer hybrid microcircuits the algorithm can be extended to advantage. Typical results using the extended algorithm are given.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:13 ,  Issue: 2 )