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The Case for Multichip LSI Packaging of High-Reliability Military Electronics

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1 Author(s)
Farrand, W.A. ; Rockwell International,Anaheim, CA

Only by a judicious combination of compatible materials, technology, and "production state of the art" can ruggedness, reliability, versatility, and utilization be realized. This choice can only be achieved through high-quality system · engineering which covers the architecture, detail engineering, manufacturing, inspection, and maintenance of the product throughout its entire service life. The thesis is that the electrical, electronic, thermal, mechanical, construction, test, and rework characteristics must be given proper weight at all points in the design. This paper presents an argument for uncased packages of multichip large-scale integrated (LSI) devices as the best solution for the high-reliability system applications presented here.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:12 ,  Issue: 4 )

Date of Publication:

Dec 1976

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