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Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface

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1 Author(s)
G. Ellison ; Tektronix,Beaverton,OR

A closed-form theoretical expression has been derived for the conductive and convective thermal resistance of frequently used electronic component and package covers. Numerical results are plotted in a manner that is applicable to a variety of devices such as flat packs, dual-in-line packages, and ceramic circuit cards,

Published in:

IEEE Transactions on Parts, Hybrids, and Packaging  (Volume:12 ,  Issue: 3 )