Cart (Loading....) | Create Account
Close category search window
 

The High Temperature Deformation Properties of Gold and Thermocompression Bonding

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Condra, L. ; Bell Labs, North Andover, MA ; Svitak, J. ; Pense, A.

The flow stress of a high purity gold has been determined so that the contribution of plastic flow to the gold<jold thermocompression bonding process can be evaluated. These compression tests at 25°C, 158°C, 311°C, and 458°C indicate that for deformations over 15% the flow stress and the work hardening coefficient decrease rapidly with increasing temperature. Correlation of the compression test results and beam lead bonding experience indicates that high purity golds having a hardness of about 30 DPH would be expected to reach a steady state uniaxial flow stress of 70-90 MPa (10,000-13,000 psi) when deformed during bonding at 300°C.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:11 ,  Issue: 4 )

Date of Publication:

Dec 1975

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.