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On Chemical Cleaning for Thermocompression Bonding

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2 Author(s)
Holloway, P.H. ; Sandia Laboratories ; Long, R., Jr.

The removal of a Cr203contaminant oxide film from gold surfaces by a ceric ammonium nitrate (CAN} etch and two different potassium iodide plus iodine (KI + I2) etchants was investigated using Auger electron spectroscopy and thermocompression (TC) bonding. It was shown that CAN effectively attacked and removed the Cr203while the KI + I2attacked the underlying gold film. The KI + I2improved the TC bondability both by undercutting some of the Cr203and by roughening the gold, thereby allowing more deformation to occur,during bonding. The implications of these results on selection of a chemical cleaning agent are discussed. The ability of CAN to dissolve a chromium adhesion layer under the gold metallization has also been investigated. It was shown that a heat treatment of 300°C for two hours in air prevented this undercutting; possible reasons are discussed.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:11 ,  Issue: 2 )

Date of Publication:

Jun 1975

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