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The Micro-Circuit-Module, A Universal Interconnection-Packaging System

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2 Author(s)
Garibotti, D. ; Hamilton Standard Div. of United Aircraft Cor. ; Ullery, L.

An interconnection - packaging system -- Micro-Circuit-Module -- has been developed which is compatible with thin film as well as semiconductor integrated circuits. The system has evolved through the developmental stages and is now in the pilot production stage. The assembling and hermetic sealing of the module are carried out by automatic electron beam processes and associated transfer-indexing machines.

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Component Parts, IEEE Transactions on  (Volume:11 ,  Issue: 2 )