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Practical methods for making LSl yield projections are described in detail. The application of these methods to multilevel metal structures in particular is presented by means of example calculations of yield based on test pattern data. Using these methods the yield of any general multilevel metal interconnection pattern can be projected. It is shown that structural density, rather than chip area alone, should be the prime consideration in yield predictions.
Parts, Hybrids, and Packaging, IEEE Transactions on (Volume:10 , Issue: 4 )
Date of Publication: Dec 1974