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This paper describes the effect of chromium deposition rate, gold deposition rate and substrate temperature on the adhesion, resistivity and thermocompression bondability of the film produced. Tantalum nitride coated, aluminum Oxide substrates were used in this work. The adhesion was checked using the standard tape test; the resistivity was measured using a four point probe; and the bondability was evaluated using both fine wires and lead frames. Auger Electron Spectroscopy was used to monitor the surface of the fiim. The results of this work permitted selection of chromium-gold deposition parameters for hybrid microcircuit production.