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A Survey of Liquid Boiling Phenomena: Their Prediction and Analysis

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1 Author(s)
V. Asch ; Lafayette College

Whether it be in the packaging of electronic components or in the design of systems for the cryogenics field, the understanding of liquid boiling phenomena and the ability to predict boiling behavior are important assets to the design engineer so involved. This paper offers an already sifted compilation of information and analyses which relates studies of all the occurrences from nucleate bailing to film boiling in a fluent story. Herein are discussed the influence of the system pressure, the cleanliness, roughness and chemical nature of the heating surface, and the wettability and degree of subcooling of the liquid. In the final partion of the paper an effort is made to tie the information presented together in what might be considered advisory remarks relative to its application.

Published in:

IEEE Transactions on Component Parts  (Volume:10 ,  Issue: 1 )