By Topic

New Profile of Ultra Low Stress Resin Encapsulants for Large Chip Semiconductor Devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
Nakamura, Y. ; NITTO Electric Industrial Company,Japan ; Uenishi, S. ; Kunishi, T. ; Miki, K.
more authors

lnternal stress, as a result of temperature cycle testing (TCT), causes package cracking, passivation film cracking, aluminum pattern deformation, etc. This is particularly evident in IC's and LSI devices with large-size chips and larger memory capacity. Greater reduction of internal stress imparted by resin encapsulants is required to address these problems. To reduce the internal stress, it was previously determined that it is effective to introduce very small sized silicone domains into the epoxy matrix and to create a strong interaction layer between the domain/matrix interface in a heterogeneous structure where soft polymer particles are dispersed as domains in the epoxy matrix as a continuous phase. To date, research efforts have yielded epoxy resins having about 0.1-µm domains with a strong interaction layer at the domain/matrix interface using special silicone modifiers. Comparisons were. made between silicone-modified epoxy resins having 2-5-µm domains and smooth domain/matrix interfaces with versions having 0.1'µm domains. From these comparisons we have drawn the following conclusion: as the silicone domain size decreases within the epoxy matrix, the internal stress imparted by the encapsulant decreases as measured by temperature cycle testing.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:10 ,  Issue: 4 )