By Topic

Immersion Cooling for High-Density Packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yokouchi, K. ; Morinosato-Wakamiya, Atsugi, Japan ; Kamehara, Nobuo ; Niwa, K.

New cooling techniques using direct immersion cooling for high-density packaging are discussed, focussing on a) the treatment of bubbles produced by nucleate boiling and b) the control of coolant composition to prevent "temperature overshoot" occurring at the boiling point as thermal hysteresis. Maintaining subcool boiling (the initial stage of nucleate boiling) until maximum power application is a useful cooling technique in high-density packaging of computers because this technique produces fewer troubles than saturated boiling. The module model, which incorporated subcool boiling, showed a high cooling capability of 10 W/cm2at the chips, and 1.0 kW for the 900-cm3module volume. Controlling coolant composition produces azeotropic boiling which, in turn, prevents temperature overshoot.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:10 ,  Issue: 4 )