By Topic

Ion Plating of Copper Film on Ultrasmooth Nonconducting Substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Prasad, S. ; Defense Electronics Research Laboratory,Hyderabad,India ; Tiku, P. ; Vijayaraghavan, M. ; Rao, S.B.

A method of obtaining copper films on ultrasmooth insulators like polished ferrites and ceramics using ion plating is reported. The films exhibit excellent bond strength and have high etching resolution and uniformity. The procedure adopted, besides eliminating one of the intermediate steps of precoating the insulator with certain metals/alloys prior to coating with copper, also reduces microwave losses. The copper coatings thus obtained satisfy all the requirements for their use in microwave integrated circuit technology.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:10 ,  Issue: 4 )