Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

New Process for Automated IC Assembly Manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Quinn, D. ; Intel Corp,Chandler, AZ ; Bond, R.

A novel assembly process, designed for automation, has been developed and implemented. This paper describes both the equipmerit and processes employed by this technology. The key features of the design are the Use of the whole top surface of the chip for assembly, large bonding pads to reduce the required mechanical accuracies, and elimination of wire bonding and chip attach by bonding the chip directly to the leadframe. All bonds are being made simultaneously to a Strip of leadframe. Other features such as the thermal and electrical characteristics, corrosion resistance, and environmental stress results are also discussed.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:10 ,  Issue: 3 )