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Equations for Estimating Wire Length in Various Types of 2-D and 3-D System Packaging Structures

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2 Author(s)
Masaki, A. ; Hitachi Ltd.,Tokyo ; Yamada, M.

Equations for estimating wire lengths in various types of two-dimensional (2-D) and three-dimensional (3-D) cell arrays are introduced'and applications of these equations are described. The singleplane packaging technique is compared with the stacked 2-D technique. The effect of increasing the number of edge connectors for Stacked 2-D designs is evaluated. Also the wire length in 3-D wafer computers is estimated.

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:10 ,  Issue: 2 )