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A very rapid increase in the conductor density of various interconnecting substrates makes it desirable to have a uniform method for evaluation of their relative density capabilities. The derivation of one such method of evaluation, based on conductor density per unit of total area of the substrate, is made. This method permits a uniform density analysis of the entire interconnection spectrum from printed to integrated circuits. It is also useful in derivation of a price-density analysis and other figures of merits for assisting in the comparison of various packaging techniques. A description of a generalized approach for development of such a graphic price-density analysis is provided.
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on (Volume:10 , Issue: 2 )
Date of Publication: Jun 1987