Scheduled System Maintenance:
On May 6th, single article purchases and IEEE account management will be unavailable from 8:00 AM - 5:00 PM ET (12:00 - 21:00 UTC). We apologize for the inconvenience.
By Topic

Characteristic Impedance of Integrated Circuit Bond Wires (Short Paper)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

In microwave circuit analysis, bond wires are frequently modeled as lumped elements or sections of microstrip. These models are insufficient since part of the wire is suspended above the substrate. This paper shows numerical results that provide the line impedance and effective dielectric constant for a round wire above a grounded dielectric substrate.

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:34 ,  Issue: 9 )