Cart (Loading....) | Create Account
Close category search window
 

Heat transfer enhancement by flow destabilization in electronic chip configurations

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Amon, Cristina H. ; Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA

Numerical simulations of the flow pattern and forced convective heat transfer in geometries such as those encountered in cooling systems for electronic devices are presented. For Reynolds numbers above the critical one, these flows exhibit a traveling-wave structure with laminar self-sustained oscillations at the least-stable Tollman-Schlichting mode frequency. Three techniques of heat transfer enhancement by flow destabilization in grooved channels are compared on an equal pumping power basis: active flow modulation, passive flow modulation, and supercritical flow destabilization. It is found that the best enhancement system regarding minimum power dissipation corresponds to passive flow modulation in the range of low Nusselt numbers. However, supercritical flow destabilization becomes competitive as the requirement for higher Nusselt numbers begins to dominate the design choices. The hydrodynamic heat transfer numerical results are obtained by direct simulation of the unaveraged energy and Navier-Stokes equations using a spectral-element-Fourier method for the spatial discretization. It is shown that computational heat transfer and, in particular, direct numerical simulation using advanced numerical schemes can contribute significantly in exploring the physics associated with heat transfer enhancement by flow destabilization

Published in:

Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on

Date of Conference:

23-25 May 1990

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.