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Polyimide stress buffers in IC technology

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5 Author(s)
Schuckert, C. ; DuPont Co., Wilmington, DE, USA ; Murray, D. ; Roberts, C. ; Cheek, G.
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A photoimagable polyimide layer which has been evaluated as a stress relief buffer for use with integrated circuits (ICs) packaged in plastic is discussed. The wafer-level overcoat process is manufacturable using available spin coat and develop tracks and is compared to conventional post wirebond die overcoating. Some properties of the polyimide layer, the manufacturing process, and the results achieved on actual commercial products are reviewed

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1990. ASMC 90 Proceedings. IEEE/SEMI 1990

Date of Conference:

11-12 Sep 1990