By Topic

New control methods and process monitoring for improving performances of power diodes manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
L. Galateanu ; Nat. Inst. R & D in Microtechnologies, Bucharest, Romania ; M. Bazu ; C. Tibeica ; E. Popa
more authors

New rapid reliability tests were introduced for monitoring, on reliability criteria, the technological processes for power diodes manufacturing. SEM, EDAX, AFM and SIMS analyses were used for the optimization of double diffusion and multi-layer metal deposition processes. New control methods and statistical graphs were introduced for monitoring the new technological conditions. Higher yields, for higher electrical and reliability performances, were obtained. The project was performed in the frame of CALIST national R and D program.

Published in:

Semiconductor Conference, 2002. CAS 2002 Proceedings. International  (Volume:2 )

Date of Conference: