Referenced Items are not available for this document.
New rapid reliability tests were introduced for monitoring, on reliability criteria, the technological processes for power diodes manufacturing. SEM, EDAX, AFM and SIMS analyses were used for the optimization of double diffusion and multi-layer metal deposition processes. New control methods and statistical graphs were introduced for monitoring the new technological conditions. Higher yields, for higher electrical and reliability performances, were obtained. The project was performed in the frame of CALIST national R and D program.
Published in:
Semiconductor Conference, 2002. CAS 2002 Proceedings. International
(Volume:2
)
Date of Conference: 2002
- Page(s):
- 347 - 350 vol.2
- Print ISBN:
- 0-7803-7440-1
- INSPEC Accession Number:
- 7597499
- Digital Object Identifier :
- 10.1109/SMICND.2002.1105865
- Product Type:
- Conference Publications
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