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The effect of polyimide fixation on thermal performance of GaAs cantilever based MEMS: a 3D numerical analysis with DEETEN

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2 Author(s)
Burian, E. ; LOX Technol., Bratislava, Slovakia ; Lalinsky, T.

We refer of novel simulation technology DEETEN based on spatial domain decomposition, capable of efficient multi-million-point 3D simulations on a conventional PC The technology has been successfully applied to 3D thermal analysis of a GaAs Micromechanical Thermal Converter microsystem.

Published in:

Advanced Semiconductor Devices and Microsystems, 2002. The Fourth International Conference on

Date of Conference:

14-16 Oct. 2002

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