Referenced Items are not available for this document.
This paper describes the microcleaved facets (MCF) process developed for AlGaAs/GaAs laser fabrication which can avoid the previous substrate cleavage and therefore be applicable to preparing both discrete short-cavity lasers and optoelectronic integrated circuits (OEIC's). An AlGaAs/GaAs double heterostructure ridge-waveguide laser with an extremely short cavity length, namely 20 μm, was first realized by this process. A threshold current as low as 20 mA and a single longitudinal mode lasing were achieved. The usefulness of this process for integrating a laser and a monitoring photodiode on a GaAs substrate is also demonstrated.
Published in:
Quantum Electronics, IEEE Journal of
(Volume:20
,
Issue:
2
)
Date of Publication: February 1984
- Page(s):
- 126 - 130
- ISSN :
- 0018-9197
- Digital Object Identifier :
- 10.1109/JQE.1984.1072369
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 January 2003
- Issue Date :
- February 1984
- Sponsored by :
- IEEE Photonics Society
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