By Topic

A novel deposit/spin waveguide interconnection (DSWI) for semiconductor integrated optics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Furuya, K. ; Tokyo Institute of Technology, Tokyo, Japan ; Miller, Barry I. ; Coldren, L.A. ; Howard, R.E.

We propose an efficient and simple optical interconnection between active semiconductor components by deposition and spin coating. Details of the waveguide design, the fabrication technique, and a promising material combination are given. Experimental results with an integrated laser-polyimide/SiOx(x sim 2) waveguide combination demonstrate low-threshold (2.0 kA/cm2) laser operation and a low-loss waveguide interconnection (81 percent coupling efficiency) on a GaInAsP/InP chip.

Published in:

Quantum Electronics, IEEE Journal of  (Volume:18 ,  Issue: 10 )