By Topic

Reliability assessment based on accelerated degradation: a case study

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Carey, M.B. ; AT&T Bell Lab., Holmdel, NJ, USA ; Koenig, R.H.

An analysis strategy (experimental and analytic) for extracting reliability information from the measured degradation of devices subjected to elevated stress is described. The strategy is applied to the estimation of the reliability of an integrated logic family that is a component of a new generation of submarine cables. The experiment consisted of monitoring several electrical parameters while aging the devices under elevated temperature. The authors model changes observed in one of these electrical parameters (propagation delay) and identify and quantify various sources of variability observed in the data. These models are used to predict (with 95% confidence) that a randomly selected device operating at 40°C will see a change of no more than 2 ns in propagation delay in 25 yr, the lifetime of a submarine cable. An analysis of the degradation rate leads to the conjecture that the observed change in propagation delay is due to the diffusion of impurities (Na) through the bulk of the oxide layer (SiO2)

Published in:

Reliability, IEEE Transactions on  (Volume:40 ,  Issue: 5 )