By Topic

Helical anisotropic magnetic film

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Takahashi, M. ; Tohoku University, Sendai, Japan ; Shinoki, F. ; Takahashi, T. ; Onodera, Y.

Permalloy films have been evaporated onto glass substrates rotating with 0.05 to 450 r/m in a d.c. magnetic field. The magnetic uniaxial anisotropy was measured by using a torque magnetometer and the hysteresis loop was taken by using a 50 Hz hysteresis loop tracer. The magnetic anisotropy and the coercive forces,H_{cparallel}andH_{cperp}, which are measured along the easy and hard axes, respectively, were obtained as a functions of the angle of ratations during deposition. The uniaxial anisotropy is found to decrease with increases in the rotating angle. No anisotropy was observed with rotating faster than π/2 r/m. The ratioH_{cparallel}/H_{cperp}, however, increase gradually for rotations beyond π r/m and becomes unity after about 5 revolution. This final state corresponds to that for the film with isotropic magnetic properties. Its hysteresis loop is quite rectangle in all directions in the film plane. A similar trend was obtained even though the ratation speed, the substrate tempertature, and the film thickness have been widely changed. These characteristics could be explained phenomenologically in terms of the postulated assumpution with the helical alignment of uniaxial anisostropy oriented through the film thickness direction.

Published in:

Magnetics, IEEE Transactions on  (Volume:8 ,  Issue: 3 )