By Topic

Analog signal correlator using superconductive integrated components

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Green, J.B. ; Massachusetts Institute of Technology, Lexington, Massachusetts ; Smith, L. ; Anderson, A.C. ; Reible, S.
more authors

Analog superconductive components have been integrated to form a device capable of cross-correlation between wideband analog input signals. The device contains a tapped niobium delay line, tunnel-junction mixers, a lumped-element L-C resonator, and a tunnel-junction comparator. The tapped delay line is realized by a niobium stripline folded in a meander pattern on a rectangular silicon substrate. An array of Nb/Nb2O5/Pb tunnel junctions acts as a mixer to form the product of delayed samples of two carrier-offset analog signals counterpropagating along the transmission line. The resultant mixer products from the junction arrays are integrated and stored in a high-Q (≈ 600) resonator consisting of a lumped-element L-C network, tuned to the offset frequency. The low-leakage capacitor dielectric is formed from electrolytically anodized niobium. A superconductive tunnel junction imbedded in the resonator circuit is operated as a variable-threshold comparator to detect the time-integrated current stored in the resonator. Performance results from such a time-integrating correlator are presented, along with a discussion of the important design issues as they relate to analog signal processing.

Published in:

Magnetics, IEEE Transactions on  (Volume:23 ,  Issue: 2 )