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Ti added Nb3Sn wires by new fabrication processes

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6 Author(s)
O. Kohno ; Fujikura Ltd., Koto-ku, Tokyo, Japan ; Y. Ikeno ; N. Sadakata ; M. Sugimoto
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The new fabrication processes for Ti addition to Nb3Sn have been developed. Using the pure Ti around Nb cores and sufficient Sn by internal plating, we have been able to get the good workability during drawing to a final diameter and the high critical current density at a higher field than 14 T. Several characteristics of both Ti foil and Ti rod processes have been discussed about the effect of Ti addition to Nb3Sn.

Published in:

IEEE Transactions on Magnetics  (Volume:23 ,  Issue: 2 )