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New fabrication technique for magnetic bubble circuits with submicron dimensions

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3 Author(s)
Morimoto, A. ; NEC Corporation, Miyamae-ku, Miyazaki, Kawasaki, Japan. ; Gokan, H. ; Yoshimi, K.

A new technique which permits the fabrication of submicrometer bubble propagation circuits has been described. Straight line patterns and contiguous zigzag patterns are combined with an appropriate registration to form bubble propagation patterns. The straight line pattern width corresponds to the gap width in the Permalloy bubble propagation circuits. By controlling the exposure time in fabricating straight line photoresist patterns, submicrometer pattern gaps are easily obtained using photomasks with 1 μm minimum features. The 4 μm period and 0.5 μm gap width permalloy circuits fabricated using this technique provide promising propagation characteristics for 1 μm bubbles: 60 Oe bias field margin at 60 Oe drive field and 25 Oe minimum propagation drive field.

Published in:

Magnetics, IEEE Transactions on  (Volume:20 ,  Issue: 6 )