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Reliability considerations in the design of one-megabit bubble memory chips

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4 Author(s)
Davies, J.E. ; Intel Magnetics, Inc., Santa Clara, CA ; Clover, R. ; Lieberman, B. ; Rose, D.

The trend toward increased density of magnetic bubble memory chips is motivated by lower cost per bit and, to a lesser extent, by lower power per bit. The design of large capacity chips must satisfy the requirements of high manufacturing yield, performance and long-term reliability. This paper describes how these requirements were met for the Intel Magnetics 7110 Bubble Memory through a cooperative design approach that involved both the bubble memory and the system support electronics chip set.

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Magnetics, IEEE Transactions on  (Volume:16 ,  Issue: 5 )