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Reliability considerations in the design of one-megabit bubble memory chips

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4 Author(s)
J. Davies ; Intel Magnetics, Inc., Santa Clara, CA ; R. Clover ; B. Lieberman ; D. Rose

The trend toward increased density of magnetic bubble memory chips is motivated by lower cost per bit and, to a lesser extent, by lower power per bit. The design of large capacity chips must satisfy the requirements of high manufacturing yield, performance and long-term reliability. This paper describes how these requirements were met for the Intel Magnetics 7110 Bubble Memory through a cooperative design approach that involved both the bubble memory and the system support electronics chip set.

Published in:

IEEE Transactions on Magnetics  (Volume:16 ,  Issue: 5 )