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Thermal analysis of microwave integrated circuits using a high resolution infrared imaging system

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2 Author(s)
W. Semon ; Loral TerraCom, San Diego, CA, USA ; W. Monks

Summary form only given. A high-resolution infrared imaging system (IRIS) used to analyze the temperature within a microwave integrated circuit (MIC) is reported. The system is used to assess the accuracy of thermal analyses of MICs. Data taken from an MIC transmitter, consisting of several subassemblies and containing heat-generating and heat-dissipating components, were compared to predicted performance for both active devices and other power-dissipating components in the MIC. Performance of the IRIS was verified by measuring the temperature of the MIC's bipolar transistor in the voltage-controlled oscillator (VCO) and of the field-effect transistor (FET) in the small-signal amplifier. The data showed unexpected heat dissipation from varactor diodes mounted on an alumina substrate in the VCO.<>

Published in:

Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE

Date of Conference:

10-12 Feb. 1988