Scheduled System Maintenance:
On May 6th, system maintenance will take place from 8:00 AM - 12:00 PM ET (12:00 - 16:00 UTC). During this time, there may be intermittent impact on performance. We apologize for the inconvenience.
By Topic

Interdiffusion in titanium permalloy thin films

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Chow, L. ; IBM General Products Division, San Jose, California ; Decker, S.K. ; Pocker, D.J. ; Pendley, G.
more authors

This paper presents the results of investigation of interdiffusion in titanium permalloy thin film. It is found that interdiffusion in titanium-permalloy thin films is very detrimental to the magnetic properties of permalloy. Severe interdiffusion can take place with composite Ti/NiFe film annealed at 250°C for 90 minutes. Auger Analysis indicates the diffusion mechanism involves mainly Ni loss from the permalloy layer and diffusion into the Ti layer. Atmospheric exposure of the Ti layer before NiFe deposition can effectively control the interdiffusion process and prevent loss of magnetoresistive response. The x-ray diffraction data has indicated the formation of a Ni-Ti alloy to which may be attributed the degradation of the magnetic properties of Permalloy.

Published in:

Magnetics, IEEE Transactions on  (Volume:15 ,  Issue: 6 )