Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Statistical analysis of power module thermal test equipment performance

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Houf, R.E. ; Allen-Bradley Co. Inc., Milwaukee, WI, USA ; Berman, D.B.

A computer-based system for determining the thermal resistance of power semiconductor modules was developed and characterized for precision by the gage study method. Results are presented to illustrate the usefulness of this statistical method for determining the measuring capability of the system. The method provides a means for demonstrating vendor/customer test capability which can reduce potential sources of conflict in part acceptance-testing

Published in:

Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE

Date of Conference:

10-12 Feb 1988