By Topic

Study of package EMI reduction for GHz microprocessors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Jiangqi He ; Intel Corp., Chandler, AZ, USA ; Dong Zhong ; Steven Yun Ji ; Gang Ji
more authors

As the operating frequency of the processor approaches 1 GHz and beyond, the package dimensions are no longer small when compared to the wavelength. In order to reduce the emissions from the package, it is necessary to include certain package design features. Three different package designs are investigated to study their relative efficiency in suppressing the emissions. The first package design uses ground patches to reduce cross talk. This scheme was observed to be increasing emissions beyond 1.5 GHz. The second package design utilized stitching vias to suppress the radiation. This scheme was observed to be ineffective in suppressing emissions due to many existing power and ground vias within the area under the die. The existing vias with checkerboard for low loop inductance design results excellent EMI reduction up to 20 GHz. The third design uses the retreated power plane to reduce the emission, and it shows good performance.

Published in:

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Date of Conference:

21-23 Oct. 2002