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This paper proposes a modified technique for extracting electrical parameters of transmission lines on printed circuit boards (PCBs). This approach results in the generation of a hybrid measurement technique that is used in conjunction with TDR (time domain reflectometry) measurement in the time domain, S-parameter measurement in the frequency domain, and empirical design data, to obtain realistic consideration points for future PCB design. While the conventional methods cover parameter extraction of a single line, this proposed method can be extended to that of multi-coupled lines.
Electrical Performance of Electronic Packaging, 2002
Date of Conference: 21-23 Oct. 2002