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Extraction method of multiline parameters for printed circuit board interconnects

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5 Author(s)
Jae-Kyung Wee ; Div. of Inf. & Comput. Sci., Hallym Univ., Kangwon, South Korea ; Yong-Ju Kim ; Han-Sub Yoon ; Seongsoo Lee
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This paper proposes a modified technique for extracting electrical parameters of transmission lines on printed circuit boards (PCBs). This approach results in the generation of a hybrid measurement technique that is used in conjunction with TDR (time domain reflectometry) measurement in the time domain, S-parameter measurement in the frequency domain, and empirical design data, to obtain realistic consideration points for future PCB design. While the conventional methods cover parameter extraction of a single line, this proposed method can be extended to that of multi-coupled lines.

Published in:

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Date of Conference:

21-23 Oct. 2002